Myriofoam improves cooling performance by a factor 2-4. Potentially solving todays performance killing overheating problems in phones, laptops, & other ICT devices.

About

“Beat the Heat” in ICT (Information and Communication Technologies)

5G , gaming & AI are just three of the CPU/GPU work loads growing exponentially, globally ....
=> overheating in cpu & gpu overloading is an escalating problem in many applications.

Myriofoam is unique, patented nanomaterial technology that provides a huge surface area in small spaces, leading to game changing cooling performance in ICT devices.

In independent tests Myriofoam improves cooling performance by up to 4X and this translates into significant value in many applications, for example:

• lighter devices performing at max GPU/CPU clock rates = VALUE
• “throttling” not necessary, gaming performance is maintained = VALUE
• stops phones overheating; & can make them thinner = VALUE

The"new normal" will be myriofoam powered "vapour chambers" (“VC’s”). The VC is the industry standard cooling device which is typically found “inside” the laptop, phone, server or other ICT device.

Inside the VC you will typically see layers of “wick material” and Myriofoam replaces traditional “wick materials” like expensive sintered Copper. Importantly this can be achieved with minimal changes to existing manufacturing processes used to cool ICT devices.

In recent months we have proven that Myriofoam works in this environment in collaboration with AVC in Taiwan, one of the worlds largest VC manufacturers.

Key Benefits

Efficient removal of heat from processing chips in ICT devices.

• lighter devices performing at max GPU/CPU clock rates = VALUE
• “throttling” not necessary, gaming performance is maintained = VALUE
• stops phones overheating; & can make them thinner = VALUE

Applications

See above. More details available under NDA .... for example use case in eVehicles, 5G servers etc.

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