Register for free to
view the full innovation profile.
The present invention relates to improvements in electrical circuits. More particularly, the invention relates to improvements particularly suited for power modules.
About
Explanation of Claimed Invention The present invention relates to improvements in electrical circuits. More particularly, the invention relates to improvements particularly suited for power modules. In particular, the present invention relates specifically to a low temperature co-fired ceramic, LTCC, process to house the bare die components of the optoelectronic devices such as light emitters and photo detectors. Problem Addressed by Claimed Invention Conventional power modules require a comprehensive thermal management system, which inevitably adds weight and cost. High temperature high density power modules will not only enhance reliability but also substantially reduce cooling requirements.
Key Benefits
• Higher operating temperatures compared with conventional optocouplers • Increase in power density due to decrease in size of power module • Provides electrical isolation for various applications superior electromagnetic interference (EMI) immunity at high temperature • Excellent electrostatic discharge (ESD) performance and increased flexibility in 3D package integration
Applications
• High density power modules • DC and AC power control PC communications • Signal isolation • Power supply regulation • Microprocessor input/output switching