Method for size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability of typically crowded electronic circuit boards
The embedding of the passive components inside packaging is starting to emerge in the industry as the process effectively combines manufacturing, component packaging and component assembly into a single manufacturing process flow, as exemplified in system-in-packaging (SIP) concepts. This embedded technology can thus achieve size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability. In our technology, ceramic thin films of high capacitance materials are embedded within the inner layers of electronic packages and replace the need for placement and assembly operations of discrete surface mounted components. Specifically, ceramic thin films are produced via a 'biomimetic' processing route on the surface of Cu foil.
Enhanced dielectric performance (much higher dielectric constant and dielectric strength than conventional ceramic-filled polymer dielectrics), Sub-micron-thick dielectric layer is possible, Biomimetic processing for ceramic thin films using self-assembled monolayers or multilayers, Environment-friendly aqueous solution processing, Processing temperature less than 100°C, followed by low-temperature post-annealing (< 200°C), Direct patterning capability.