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New liquid cooling system for high-power electronics.
About
A new liquid cooling system which is a combination of embedded channels and cold plates has been designed. This novel cooling system consists of two sections: a top section which is connected to the package, and a bottom section which is connected to the liquid inlet and outlet.
Key Benefits
This liquid cooling system can remove more heat than other cooling methods, like embedded cooling and cold plates only (heat flux range 0.5 W/cm2-300W/cm2). It can be used for a wide range of applications and geometries. This novel cooling system can be fabricated with different fabrication methods, materials, and dimensions. Different coolant liquids can be used based on the application and the amount cooling required.