This invention manages thermal challenges in increasingly high power applications and “hot” chip packages.
The present invention provides an innovative improvement in conductive adhesives and anisotropic conductive adhesive interconnection technology by growing or attaching nano-structures to the interconnect particles and the microcircuit connect pads
• Suitable replacement for a significant percentage of current TIM materials, including bulk Indium with metal nanostructures having fins or spikes in contact with each other, allowing heat to percolate through and out
• Enables a significant increase in dissipation associated with increasingly high power electronics
• Reduces interfacial resistance by an order of magnitude
• Thermal grease can also be filled with interlocking nanostructures