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The Technique has been demonstrated at bench level - supporting information on laser parameters etc. is available under CDA.
About
Researchers at Heriot-Watt University (Edinburgh, Scotland) have developed an adhesive free method for writing conductive tracks on Dielectrics, Ceramic or LCP film/ foils providing a strong bond and leaving no residues that could potentially de-gas or cause failure. Using a similar set up to the Laser Induced Forward Transfer Process (LIFT Process) where a laser deposits metal from a carrier film to the substrate, the Heriot-Watt process is carrier free and uses "temporary adhesion forces" making it suitable for flexible, small scale production, or prototyping applications. Applications would include the design & fabrication of antenna, filters & circuits for communication devices. IP Status Patent coverage has lapsed and Heriot-Watt University is seeking collaborative development on this innovation through sponsorship of PhD candidates or industrial partnership - ideally with a company who has experience of laser processing and sees utility in the application and would like to support technological development in defined areas.
Key Benefits
Adhesiveless process - no contamination of substrates High Speed, High Definition process - laser scanning using precision XYZ stage Application to non-planar surfaces
Applications
Rapid Prototyping & small scale manufacture Suitable for manufacturing Antenna, Filters, Electrodes etc.. Direct writing of conducting tracks on films & rigid substrates